PC/ABS CHIMEI PC‑545
PC/ABS CHIMEI PC‑545
PC/ABS CHIMEI PC‑545 is a halogen‑free flame‑retardant, high‑temperature‑resistant injection‑molding grade alloy plastic. It also possesses favorable gloss, good toughness and impact strength.
Main Applications
Electrical‑Electronic: notebook computer housings, laser printer components.
Automotive Parts: automotive interior parts.
Communication equipment, home‑appliance products and lighting devices.
Physical Properties
| Test Item | Test Standard | Unit | Typical Value | Test Condition |
|---|---|---|---|---|
| Density | ISO 1183 | g/cm³ | 1.20 | 23℃ |
| Melt Mass‑flow Rate | ISO 1133 | g/10min | 18 | 260℃ / 5 kg |
| Tensile Strength | ISO 527‑2 | MPa | 55 | 50 mm/min, 23℃ |
| Flexural Modulus | ISO 178 | MPa | 2300 | 2 mm/min, 23℃ |
| Notched Impact Strength | ISO 179/1eA | kJ/m² | 65 | 23℃ (ambient) |
| Notched Impact Strength | ISO 179/1eA | kJ/m² | 48 | ‑30℃ (low temperature) |
| Rockwell Hardness | ISO 2039‑2 | R scale | 115 | 23℃ |
Injection Molding Process
| Parameter | Recommended Value | Failure Risk Control |
|---|---|---|
| Drying Condition | 90℃ × 4 h | Moisture content＞0.03% → electroplating bubbles |
| Barrel Temperature | Rear 220℃ / Middle 235℃ / Front 245℃ | Temperature＞250℃ → thermal decomposition causes plating peeling |
| Mold Temperature | 75‑85℃ | Below 70℃ → flow marks; above 90℃ → mold sticking |
| Injection Speed | Medium‑high speed | Low speed → weakened weld‑line and electroplating bonding force |
| Holding Pressure | 50 % of injection pressure | Excessive holding pressure → internal stress triggers electroplating cracking |
Note: All information above is for reference only!
